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PO_SingleChip

688nm, 1mW

1mW 688nm VCSEL Bare Chip
Part # PSM-BC-001-W0688
[Datasheet PDF]

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Product Description

Product Description

• Vertical-Cavity Surface-Emitting Laser technology
• 1mW single transverse and longitudinal mode power at 688nm

Optical & Electrical Characteristics

PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
CW Output Power
Iop, 20°C Heat-sink
1.0
mW
Threshold current
20°C Heat-sink
0.2
0.3
0.45
mA
Operating current
Pout, 20°C Heat-sink
1.7
2
2.2
mA
Operating voltage
Pout, 20°C Heat-sink
2
2.3
2.6
V
Differential resistance
Pout, 20°C Heat-sink
290
500
870
Ω
Slope efficiency
20°C Heat-sink
0.6
0.7
0.85
W/A
Conversion efficiency
Pout, 25°C
12
23
%
Center wavelength
Pout, 20°C Heat-sink
678
688
698
nm
Side-Mode Suppression Ratio
Pout, 20°C Heat-sink
-15
-30
dB
Wavelength shift
20°C Heat-sink
0.055
0.070
nm/°C
Beam divergence (FW 1/e2)
Pout, 20°C Heat-sink
16
°

Mechanical Characteristics: Bare Die

PARAMETER
VALUE
Die width
250 ± 10 μm
Die length
250 ± 10 μm
Die height
110 ± 20 μm
Max solder temperature
220 °C

Mechanical Characteristics: Chip on Submount

PARAMETER
VALUE
Package width
2.0 ± 0.05 mm
Package length
2.0 ± 0.05 mm
Package height
< 0.7 mm
Max solder temperature
150 °C
Metallization
Ti/Pt/Au

Ordering Information

pcw-bc-001-w0688

Delivery and Returns Content description.