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PO_SingleChip

945nm, 4mW

4mW 945nm VCSEL Bare Chip
Part # PCW-BC-004-W0945
[Datasheet PDF]

Product Description

Product Description

• High Power Conversion Efficiency
• Excellent temperature stability : less than 10% variation in efficiency within 20 0C to 80 0C
• Wavelength stabilized (0.07 nm per 0C) & narrow spectral width (< 1nm TYP)

Optical & Electrical Characteristics

PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
CW Output Power
Iop, 20°C Heat-sink
3.5
4
mW
Threshold current
20°C Heat-sink
0.9
1.5
mA
Operating current
Pout, 20°C Heat-sink
5
mA
Operating voltage
Pout, 20°C Heat-sink
1.75
V
Differential resistance
Pout, 20°C Heat-sink
90
Slope efficiency
20°C Heat-sink
0.85
1.0
W/A
Conversion efficiency
Pout, 20°C Heat-sink
38
43
%
Center wavelength
Pout,Heat-sink
935
945
955
nm
Spectral width (FWHM)
Pout, 20°C Heat-sink
0.8
1
nm
Wavelength shift
20°C Heat-sink
0.07
0.07
nm/°C
Beam divergence (FW 1/e²)
Pout, 20°C Heat-sink
17 × 17
 °

Mechanical Characteristics: Bare Die

PARAMETER
VALUE
Die width
175 ± 10 μm
Die length
175 ± 10 μm
Die height
100 ± 10 μm
Max solder temperature
220 °C

Mechanical Characteristics: Chip on Submount

PARAMETER
VALUE
Package width
2.0 ± 0.05 mm
Package length
2.0 ± 0.05 mm
Package height
< 0.7 mm
Max solder temperature
150 °C
Metallization
Ti/Pt/Au

Ordering information

pcw-bc-004-w0945

Delivery and Returns Content description.