Princeton Optronics offers…

  • Optical Design Service
  • Combined optical, mechanical and thermal design for complex subsystems
  • Rapid prototyping of complex optical subsystems (particularly subsystems
  • requiring unique expertise of laser welding)
  • Production of small quantity or in volume
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princeton-leader

Leading technology provider

Princeton Optronics, Inc. is the leading technology provider for VCSELs and VCSEL based optical modules building. In addition to high performance VCSELs we build specialized optical devices and subsystems meeting very precise tolerances and high levels of reliability. Custom products include high power illumination modules, pump laser packages and visible lasers with direct frequency doubling We have packaged many different kinds of lasers and laser based subsystems. We have strong background in packaging optoelectronics devices to meet the MIL STD-883 and Telcordia GR-468.

The company is now offering its unique solutions for advanced prototype fabrication and manufacturing services for fabricating lasers and laser based subsystems for the communications, aerospace, military, medical and industrial markets.

Technical Services – Concept to Manufacturing of Complex Optical Products

Princeton Optronics can help transfer a layout of your optical design or a paper concept into a manufacturable laser product. Backed by venture capital companies, it has all types of sophisticated equipment for development and manufacture of laser and laser related subsystem packages in high volume. Our world class team has the highest level of industrial experience and expertise in laser physics, optics and optoelectronic packaging. Our strong technical capabilities can support all your requests for laser assembly.

  • Laser modeling (In-house developed software)
  • Mechanical design (AutoCAD, SolidWorks)
  • Finite element analysis – stress, modal and thermal (ANSYS multiphysics and
  • COMSOL multiphysics)
  • Optical analysis (Glad, Zmax)
  • Optical bench experiments
  • Rapid prototyping
  • Product qualification (Telcordia, MIL-STD–., etc)
  • Failure analysis
  • Production
  • Reliability test

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Packaging Technology

Princeton Optronics’ packaging technology is built upon a platform of free space optical integration. The platform provides a flexible approach for building a wide range of solid state laser cavities. Laser welding is used extensively in our fabrication process, which improves the reliability of the products. It is a proven technology to address many critical issues in laser packaging such as:

  • High precision and accuracy of cavity alignment
  • Robustness and stability under the vigorous environmental conditions (humidity, stress, temperature cycle, shock/vibration)
  • Temperature control and heat dissipation
  • Materials compatibility
  • Packaging miniaturization

The alignment of a typical laser cavity is an operation involving six degrees of freedom. Usually multiple components have to be aligned simultaneously with very high precision and accuracy. A small amount of misalignment can significantly compromise a laser’s performance of output power, wavelength, line width, pulse characteristics, transverse mode, noise and polarization, etc. At Princeton Optronics, our laser physicists have designed and demonstrated many miniature laser cavities on optical bench. And our packaging engineers have successfully made those laser designs into products of equal, if not better, optical performance, but smaller footprint, more efficient thermal management and better structural stability. A typical laser package development will go through:

  • Tolerance budget analysis through both modeling and experiment
  • Modularize construction through optimal tolerance allocation
  • Physical design via 3D modeling
  • Mechanical and thermal analysis for design optimization
  • Determine assembly procedure for process-ability
  • Proprietary mounting technology of sub-micron linear and milli-degree angular tolerances.
  • Laser welded structure to ensure the long term stability
  • High degree mechanization with precision fixture/tooling

Developed Packages

Princeton Optronics has successfully built various lasers and laser related photonics packages. They are the best of their kind in the industry. Our design and process capabilities can be testified by these packages such as:

  • C-band external cavity tunable laser in a 16-pin butterfly package (Telcordia qualified) and integrated control electronics
  • High power VCSELs (>1kW/cm^2)
  • Narrow divergence VCSEL with microlens array
  • 980nm pump modules with compound or cylindrical lenses
  • Low noise and narrow line width laser
  • Directly coupled lithium niobate transmitter
  • Athermalized wavelength locker
  • Piezo based tunable Etalon
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princeton-facilities

Facilities

  • Class 10K/1K/100 clean rooms, wafer fab, and assembly stations.
  • Die attach (die bonder, vacuum solder, thermal/UV epoxy), Die shear tester
  • Wire bond, ribbon bond, Wire bond pull tester
  • Laser weld (R&D station, production stations, pulse stepping and pulse shaping)
  • Surface preparation (grind, polish, metallization)
  • Machine shop
  • Hermetic seal (seam weld, de-lid machine)
  • Fine and gross leak test
  • Broad capability of laser performance characterization
  • Incoming inspection system
  • Screening/burn-in, accelerated aging
  • Mechanical shock and vibration.
  • Damp heat (85/85), temperature cycle and thermal shock

Product Qualification

Princeton Optronics has a product qualification system in place which are implemented on production level products.

  • All Processes Documentation (assembly procedure, traveler, etc.)
  • All Product Drawings Released under Change Control
  • Incoming inspection
  • Screening/burn-in
  • Accelerated aging, ESD protection
  • Die shear tester
  • Wire bond pull tester
  • Fine and gross leak test
  • Mechanical shock and vibration.
  • Damp heat (85/85), and thermal shock.
  • Temperature cycling

Princeton Optronics will work with the customer to determine which level of qualification is needed for the product and implement it on the product.

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